REG1117-3.3,TLV2462IDGKR,LS-215,FDD7N20TM,DZ600N12K,AGDR-71C,SG100400TR-48.00,KTY82/210/G，215,LPC1102UK，118,49-CBSA-5.75X6.0X0.4,XCSU100P-2SBVF784E

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	Part No.	MFG	D/C	QTY	Packing	Package	Note
	REG1117-3.3	TI	2010+	3000	SOP-4		Original 全新原装
	TLV2462IDGKR	TI	0649+	2500	MSOP-8		Original 全新原装
	LS-215		09+	8000	SOP
	FDD7N20TM	Fairchild	11+	2400	TO-252(DPAK)		现货代理
	DZ600N12K	Infineon	10+	287	可控硅模块		专业模块
	AGDR-71C	ABB	12+	152	驱动板		ABB驱动板全新原装
	SG100400TR-48.00	Orbel	20+	19975			簧片
	KTY82/210/G,215	NXP	21+	8000	TO-236AB		硅温度传感器
	LPC1102UK,118	NXP	21+	1500	WLCSP		ARM微控制器
	49-CBSA-5.75X6.0X0.4	Leader	20+	2013			射频盾板
	XCSU100P-2SBVF784E	AMD		2	784-FCBGA（23x23）		FPGA（现场可编程门阵列）

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