D3I2023,D3C0780S-7,D4C3742-2,D3C2731-6,TMPM333FYFG(C),PIC18F2321-I/ML,PIC16C62B-20I/SS,PIC16F877AT-I/PT,MSP430F5519IPNR,DSPIC33FJ128GP802-I/MM

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	Part No.	MFG	D/C	QTY	Packing	Package	Note
	D3I2023	DiTom	2020+	7308	隔离器		射频环行器和隔离器
	D3C0780S-7	DiTom	2020+	3515	环形器		射频环行器和隔离器
	D4C3742-2	DiTom	2020+	1000	环形器		射频环行器和隔离器
	D3C2731-6	DiTom	2020+	4606	环形器		射频环行器和隔离器
	TMPM333FYFG(C)	Toshiba		252	100-LQFP（14x14）		MCU
	PIC18F2321-I/ML	Microchip		3464	28-QFN（6x6）		MCU
	PIC16C62B-20I/SS	Microchip		1954	28-SSOP		MCU
	PIC16F877AT-I/PT	Microchip		2156	44-TQFP（10x10）		MCU
	MSP430F5519IPNR	TI		302	80-LQFP（12x12）		MCU
	DSPIC33FJ128GP802-I/MM	Microchip		5606	28-QFN-S（6x6）		MCU

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