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Part No. MFG D/C QTY Packing Package Note
DT61N12KOF Infineon 16+ 10 分立半导体模块
DS28E25+ Maxim 16+ 2662 TO-92-2 电可擦除可编程只读存储器
D3I1213-2 DiTom 2020+ 1448 隔离器 射频环行器和隔离器
MAX2010ETI+ Maxim 19+ 17 28-wfqfn 裸露焊盘 rf 前置补偿器
CS3301-ISZR Cirrus 500 24-SSOP 可编程增益,差分 比较器
XCS20XL-4TQG144I AMD 198 144-LQFP FPGA(现场可编程门阵列)


Part No. MFG D/C QTY Packaging Package
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