MG600Q1US59A,CD74HC221M96G4,SG572648FG8SZIL1,SQJB00EP,SQJB60EP,SQJ200EP,SQJ262EP,SM1218MC2MDC,SME0607C18AA,SMT2527E01Z,SM0408LC2MDB,1005190F0-AA70L0050,4789PA51H00049,4060AD51K00768,MKE15Z256VLL7,UC3841Q,XCV300E-7FG456C

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	Part No.	MFG	D/C	QTY	Packing	Package	Note
	MG600Q1US59A	TOSHIBA	10+	200	IGBT 模块		IGBT 模块
	CD74HC221M96G4	TI	11+	5000	SOIC16(D)	2500\|TR	代理TI全线品牌
	SG572648FG8SZIL1	SMART	16+	95	存储器模块		DIMM\|SIMM
	SQJB00EP	VISHAY	17+	5000	PowerPAK SO-8L		MOSFET汽车
	SQJB60EP	VISHAY	17+	2000	PowerPAK SO-8L		MOSFET汽车
	SQJ200EP	VISHAY	17+	8000	PowerPAK SO-8L Dual Asymmetric		MOSFET汽车
	SQJ262EP	VISHAY	17+	1900	PowerPAK SO-8L Dual Asymmetric		MOSFET汽车
	SM1218MC2MDC	AD	19+	1736			MODULATOR
	SME0607C18AA	AD	19+	9009			I/Q ENHANCED MODULATOR
	SMT2527E01Z	AD	19+	2926			SINGLE SIDEBAND UPCONVERTER
	SM0408LC2MDB	AD	19+	9009			I/Q MODULATOR
	1005190F0-AA70L0050	AVX	19+	1000			ANTENNA ASSY, UWB68 F0 0050 MHF
	4789PA51H00049	Amphenol	20+	5349			防护接触指，预紧
	4060AD51K00768	Leader	20+	18000			簧片
	MKE15Z256VLL7	NXP	21+	2000	LQFP100		ARM微控制器
	UC3841Q	TI		3000	20-PLCC（9x9）	限流，使能，频率控制，斜坡，复位，软启动	DC-DC 开关控制器
	XCV300E-7FG456C	AMD		30	432-LBGA 裸焊盘，金属		FPGA（现场可编程门阵列）

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