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Part No. MFG D/C QTY Packing Package Note
SST26VF032BAT-104I/MF Microchip 16+ 2957 闪存Flash Memory
D4C7012-4 DiTom 2020+ 1589 环形器 射频环行器和隔离器
LPC55S26JBD64K NXP 21+ 5600 HTQFP64 ARM微控制器
LM4040CIM3-5.0-TR Microchip 870 SOT-23-3 电压基准
XCVP1402-1LSEVSVA3340 AMD 45 3340-FCBGA(55x55) 片上系统(SoC)


Part No. MFG D/C QTY Packaging Package
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