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Part No. MFG D/C QTY Packing Package Note
D3I2023 DiTom 2020+ 7308 隔离器 射频环行器和隔离器
D4C3742-2 DiTom 2020+ 1000 环形器 射频环行器和隔离器
D4C3742-3 DiTom 2020+ 1930 环形器 射频环行器和隔离器
STM32F078CBT6 ST 490 48-LQFP(7x7) MCU
PIC16F877AT-I/PT Microchip 2156 44-TQFP(10x10) MCU
MSP430F5519IPNR TI 302 80-LQFP(12x12) MCU
DSPIC33FJ128GP802-I/MM Microchip 5606 28-QFN-S(6x6) MCU
PIC24HJ128GP310-I/PF Microchip 2330 100-TQFP(14x14) MCU


Part No. MFG D/C QTY Packaging Package
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