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Part No. MFG D/C QTY Packing Package Note
MAX813LEPA MAXIM 05+ 490 DIP Original 全新原装
MSM5000A QUALCOMM 00+ 73 BGA Original 全新原装
MSM1G08UOA-PCBO SAMSUNG 04+ 45 QFP Original 全新原装
MAX9310AEUP MAXIM 08+ 2200 TSSOP20 Original 全新原装
DG412FEUE MAXIM 08+ 2100 TSSOP16 Original 全新原装
ADUCM3029BCPZ ADI 2975 64-LFCSP-WQ(9x9) MCU
PIC16F18074T-I/PT Microchip 384 44-TQFP(10x10) MCU
MKE02Z16VFM4 NXP 3112 32-HVQFN(5x5) MCU
R7F100GGG3CFB#BA0 Renesas 2173 - MCU
R7F100GAG2DSP#BA0 Renesas 2750 - MCU
MKV10Z32VLF7 NXP 2660 48-LQFP(7x7) MCU
ATSAMDA1E15B-MBT Microchip 2127 32-VQFN(5x5) MCU


Part No. MFG D/C QTY Packaging Package
Note


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